Surface Impedance Boundary Condition with Circuit Coupling for the 3D Finite Element Modeling of Wireless Power Transfer

Desmoort, Alexis; De Grève, Zacharie; Dular, Patrick (FNRS, ULg); Geuzaine, Christophe (ULg); Deblecker, Olivier

Article (Scientific journals)

Desmoort, Alexis; De Grève, Zacharie; Dular, Patrick (FNRS, ULg) et al.

2017 • In IEEE Transactions on Magnetics, 53 (6)

Peer Reviewed verified by ORBi

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https://hdl.handle.net/20.500.12907/30974

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Disciplines :

Electrical & electronics engineering

Author, co-author :

Desmoort, Alexis ; Université de Mons > Faculté Polytechnique > Génie Electrique

De Grève, Zacharie ; Université de Mons > Faculté Polytechnique > Génie Electrique

Dular, Patrick (FNRS, ULg)

Geuzaine, Christophe (ULg)

Deblecker, Olivier ; Université de Mons > Faculté Polytechnique > Génie Electrique

Language :

English

Title :

Surface Impedance Boundary Condition with Circuit Coupling for the 3D Finite Element Modeling of Wireless Power Transfer

Publication date :

01 June 2017

Journal title :

IEEE Transactions on Magnetics

ISSN :

0018-9464

Publisher :

Institute of Electrical and Electronics Engineers, United States - New Jersey

Volume :

Issue :

Peer reviewed :

Peer Reviewed verified by ORBi

Research unit :

F101 - Génie Electrique

Research institute :

R200 - Institut de Recherche en Energie

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since 25 January 2017

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