Robustness evaluation of adhesively bonded ceramic quad flat chips for space applications

Contribution to collective works (Parts of books)

Ben Fekih, Lassaad; Kouroussis, Georges; Verlinden, Olivier et al.

2015 • In Vibration Engineering and Technology of Machinery, Springer books series Mechanism and Machine Science, Vol. 23

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https://hdl.handle.net/20.500.12907/21462

LBF2015a - VCX1053_48.pdf

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Disciplines :

Art & art history
Mechanical engineering

Author, co-author :

Ben Fekih, Lassaad ; Université de Mons > Faculté Polytechnique > Mécanique rationnelle, Dynamique et Vibrations

Kouroussis, Georges ; Université de Mons > Faculté Polytechnique > Mécanique rationnelle, Dynamique et Vibrations

Verlinden, Olivier ; Université de Mons > Faculté Polytechnique > Service de Mécanique rationnelle, Dynamique et Vibrations

De Fruytier, Christophe

Language :

English

Title :

Robustness evaluation of adhesively bonded ceramic quad flat chips for space applications

Publication date :

01 January 2015

Main work title :

Vibration Engineering and Technology of Machinery, Springer books series Mechanism and Machine Science, Vol. 23

Publisher :

Springer

ISBN/EAN :

978-3-319-09917-0

Pages :

547-557

Research unit :

F703 - Mécanique rationnelle, Dynamique et Vibrations

Research institute :

R500 - Institut des Sciences et du Management des Risques

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since 19 August 2014

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