3D thermal conduction networks; Boron nitride; Epoxy composites; Graphene nanoplatelets; Thermal management; 3d thermal conduction network; Boron nitride nanosheets; Electronic industries; Epoxy composite; Honeycomb architecture; Miniaturisation; Thermal; Thermal conduction; Thermal management strategy; Condensed Matter Physics; Surfaces and Interfaces; Surfaces, Coatings and Films
Abstract :
[en] The progressive miniaturization and integration within the electronics industry demand advanced thermal management strategies for electronic devices. Two-dimensional materials, notably single-layer hexagonal boron nitride nanosheets (BNNS) and graphene nanoplatelets (GNPs), are recognized for their exceptional thermal properties, with intrinsic thermal conductivity of approximately 400 W·m−1·K−1 for BNNS and exceeding 5000 W·m−1·K−1 for graphene. Here, a biomimetic honeycomb architecture is reported, fabricated via physical foaming and freeze-drying with surface-hydroxylated GNPs (m-GNPs) and dopamine-functionalized h-BN (m-BN) as functional building blocks. The lightweight 3D GNP-BN hybrid skeleton supports 3000 × its own weight and enables continuous thermal conduction pathways in an epoxy matrix (EP). The 15 wt% GNP-BN/EP composite exhibits a through-plane thermal conductivity of 1.21 W·m−1·K−1, which is 537 % higher than that of pure EP, while maintaining excellent electrical insulation (>108 Ω·cm). This arises from the hierarchical honeycomb architecture: strong hydrogen bond interfaces between m-GNPs and m-BN, reducing interfacial thermal resistance (ITR), whereas the wide bandgap of h-BN (∼6 eV) effectively hindering electron transport despite GNP's conductivity. The electrical insulation of h-BN and ultra-high TC of GNP are synergistically integrated, along with a lightweight honeycomb structure, endowing this composite material with outstanding performance for heat dissipation in miniaturized electronics.
Disciplines :
Chemistry
Author, co-author :
Guan, Xiaochong; School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Liu, Kai; School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Xie, Fei ; School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Li, Junting; School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Yang, Hui; Zhejiang-California International Nanosystems Institute, Zhejiang University, Hangzhou, China
Bittencourt, Carla ; Université de Mons - UMONS > Faculté des Sciences > Service de Chimie des Interactions Plasma-Surface
Li, Wenjiang ; School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Language :
English
Title :
3D hybrid skeleton of graphene nanoplatelet/boron nitride for enhancing thermal conductivity of flexible epoxy composites
R400 - Institut de Recherche en Science et Ingénierie des Matériaux
Funders :
F.R.S.-FNRS - Fonds de la Recherche Scientifique Tianjin University of Technology
Funding text :
This work was supported by Tianjin University of Technology - Yulin City (Xingye) Calcium-based Materials Research Center; CB thanks the Belgian Fund for Scientific Research under the FRFC contract CDR J001019 . CB is a Senior Research of the National Funds for Scientific Research (FRS-FNRS, Belgium).
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