Article (Scientific journals)
Nanoparticulate origin of intrinsic residual stress in thin films
Guisbiers, G.; Van Overschelde, Olivier; Wautelet, Michel
2007In Acta Materialia, 55 (10), p. 3541-3546
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Abstract :
The formation of grains in thin films generates intrinsic residual stress. In this work, we present a model of intrinsic residual stress calculation based on the size-dependent phase transitions of the nanograins. Evaporated thin films are produced by condensation from the vapor on the substrate. It is assumed that the starting nanograins grow from the liquid phase. It is well established that the melting temperature of nanoparticles is a function of their size. By assuming that the intrinsic stress originates from the volume change of the nanograins, and taking into account relaxation processes, the generated intrinsic residual stress in the films is evaluated. The results of the model are compared quantitatively with experimental data obtained from Ta, Mo, Pd and Al films deposited on Si. This model also gives a theoretical interpretation of Thornton and Hoffman's modelling of the stress-temperature diagram of thin films.
Disciplines :
Mechanical engineering
Chemistry
Physics
Author, co-author :
Guisbiers, G.
Van Overschelde, Olivier ;  Université de Mons > Faculté des Sciences > Chimie des Interactions Plasma-Surface
Wautelet, Michel ;  Université de Mons > Faculté des Sciences > FS - Service du Doyen
Language :
English
Title :
Nanoparticulate origin of intrinsic residual stress in thin films
Publication date :
01 June 2007
Journal title :
Acta Materialia
ISSN :
1359-6454
eISSN :
1873-2453
Publisher :
Elsevier, Netherlands
Volume :
55
Issue :
10
Pages :
3541-3546
Peer reviewed :
Peer Reviewed verified by ORBi
Research unit :
S882 - Chimie des Interactions Plasma-Surface
M104 - Physique biomédicale
Research institute :
R400 - Institut de Recherche en Science et Ingénierie des Matériaux
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