Robustness evaluation of adhesively bonded ceramic quad ﬂat chips for space applications

[en] Ceramic quad flat packs (CQFP) electronic components have long been used in power devices in the space industry. Soldering CQFPs to a printed circuit board (PCB) is not sufficient and thus the use of adhesives for reinforcement is compulsory. In fact, the risk of failure becomes very high during launch missions due to harsh constant and random accelerations. The paper investigates various distributions of two common thermally conductive and one epoxy adhesives. The intention is to compare the effects of these adhesive bonds on the robustness to vibrations of solder joints. Results are generated from a finite element (FE) model consisting of a CQFP component, an adhesive layer and a PCB. Key outputs such as the maximum deflection of the PCB, the stress in the solder joints and the fatigue lifetime of the assembly are discussed. Recourse to FE simulations allows competitiveness in terms of design cost and delivery time.

Disciplines :

Art & art history
Physics

Author, co-author :

Ben Fekih, Lassaad ; Université de Mons > Faculté Polytechnique > Mécanique rationnelle, Dynamique et Vibrations

Kouroussis, Georges ; Université de Mons > Faculté Polytechnique > Mécanique rationnelle, Dynamique et Vibrations

Verlinden, Olivier ; Université de Mons > Faculté Polytechnique > Mécanique rationnelle, Dynamique et Vibrations

De Fruytier, Christophe

Language :

English

Title :

Robustness evaluation of adhesively bonded ceramic quad ﬂat chips for space applications

Publication date :

11 September 2014

Event name :

10th International Conference on Vibration Engineering and Technology of Machinery - VETOMAC-X

Event place :

Manchester, Unknown/unspecified

Event date :

2014

Research unit :

F703 - Mécanique rationnelle, Dynamique et Vibrations

Research institute :

R500 - Institut des Sciences et du Management des Risques

Available on ORBi UMONS :

since 08 July 2014

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Bibliography

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