Article (Scientific journals)
Nano copper-modified GO and CNTs for enhanced the epoxy resin composite thermal properties
Yuan, Miao; Zhang, Yi; Xie, Fei et al.
2025In Applied Surface Science, 690, p. 162616
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Keywords :
Carbon nanotubes; Graphene oxide; Low filler levels; Thermal properties; Composite thermal properties; Cu nanowires; Epoxy resin composites; Graphene oxides; High aspect ratio; Low filler level; Nano copper; Property; Reduced graphene oxides; Thermal; Condensed Matter Physics; Surfaces and Interfaces; Surfaces, Coatings and Films
Abstract :
[en] Efficient heat dissipation and reduced interface thermal resistance have become an important factor in the advancement of modern electronics. Herein, high aspect ratio Cu nanowires (Cu NWs) and uniform dispersed copper nanoparticles (Cu NPs) were in-situ grown on reduced graphene oxide (rGO) and carbon nanotubes (CNTs) using an one-pot hydrothermal method to obtain a Cu-rGO-CNTs hybrid (CuGNT). The CNTs were carboxylated through acid treatment, which enhanced their hydrophilicity. The creation of the well-dispersed Cu NPs and the high aspect ratio Cu NWs was aided by rGO that was transformed from GO throughout the synthesis. The CuGNT hybrid was used as fillers uniformly dispersed in an epoxy resin (EP) matrix, forming an epoxy composite (CuGNT-EP). The filler formed a 3D-interconnected network, which significantly enhanced the thermal conductivity (the thermal conductivity enhancement factor 87.37 %) of the pure epoxy resin even at low filler levels (relative to 2 wt% of EP content) and maintain high tensile strength (33.76 Mpa). Moreover, the filler has excellent thermal stability and oxidation resistance and the filler does not form a complete conductive path, thereby meeting the requirements for antistatic functionality (> 109 Ω·m). Therefore, the CuGNT-EP composite shows great potential for semiconductors, IC packaging, and aerospace applications.
Disciplines :
Chemistry
Author, co-author :
Yuan, Miao;  School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Zhang, Yi;  School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Xie, Fei;  School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Yang, Hui;  Zhejiang–California International Nanosystems Institute, Zhejiang University, Hangzhou, China
Bittencourt, Carla  ;  Université de Mons - UMONS > Faculté des Sciences > Service de Chimie des Interactions Plasma-Surface
Snyders, Rony  ;  Université de Mons - UMONS > Faculté des Sciences > Service de Chimie des Interactions Plasma-Surface
Li, Wenjiang;  School of Materials Science and Engineering, School of Chemistry and Chemical Engineering, Tianjin University of Technology, Tianjin, China
Language :
English
Title :
Nano copper-modified GO and CNTs for enhanced the epoxy resin composite thermal properties
Publication date :
May 2025
Journal title :
Applied Surface Science
ISSN :
0169-4332
eISSN :
1873-5584
Publisher :
Elsevier B.V.
Volume :
690
Pages :
162616
Peer reviewed :
Peer Reviewed verified by ORBi
Research unit :
S882 - Chimie des Interactions Plasma-Surface
Research institute :
Research Institute for Materials Science and Engineering
Funders :
Innovative Research Group Project of the National Natural Science Foundation of China
Guangxi Key Research and Development Program
National Natural Science Foundation of China
Funding text :
This work was financially supported by the Guangxi Key Research and Development Program ( 2021AB23009 ) and the National Natural Science Foundation of China (Nos. 22271219 , 21911530255 ).
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